Monday, June 13, 2011

HTC and others are testing NMT metal/plastic bonding for thinner but tougher smartphone chassis

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The Nano Molding Method fuses the plastic against the etched metal, removing the need for various attachment latches or slots, blending the metal and plastic elements in one thin but durable whole...

Phone Arena 13 Jun, 2011


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Source: http://www.phonearena.com/news/HTC-and-others-are-testing-NMT-metalplastic-bonding-for-thinner-but-tougher-smartphone-chassis_id19524
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